MAGAZINE
March
Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031
The Advanced Semiconductor Packaging Market was valued at USD 18090 Million in the year 2024 and is projected to reach a revised size of USD 29800 Million by 2031, growing at a CAGR of 7.5% during the forecast period.
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
OKI Circuit Technology has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
ASIC and SoC Design Partner Rebrands as Aion Silicon
Aion Silicon (formerly Sondrel), a premier ASIC/SoC architecture and design partner, today officially unveiled its new name, vision, and leadership team.
ROHM Develops New High Power Density SiC Power Modules
ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles).
Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance
Aion Silicon (formerly Sondrel) today announced it has joined the Intel Foundry Accelerator Design Services Alliance.
ChEmpower Secures $18.7M to Advance Abrasive-Free Planarization in Chip Manufacturing
New investment to drive sustainability in advanced AI chip manufacturing.
Microchip Unveils New High-Density Power Module for AI at the Edge Applications
AI at the edge is driving increased integration and power consumption, requiring advanced power management solutions for industrial automation and data center applications.
M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation
M31 Technology Corporation (M31), a global provider of silicon intellectual property (IP), today announced that its eUSB2 PHY IP has achieved silicon-proven status on TSMC’s 3nm process and has successfully completed tape-out on TSMC’s 2nm process.
Holography Innovator VividQ Opens U.S. Headquarters in Silicon Valley
VividQ, a deep technology innovator in computational holography, today announced the opening of its first U.S. headquarters in Palo Alto, California and the appointment of veteran tech executive Mark Morrison as Vice President of Sales.
Advanced Chip Packaging/Microsystems Breakthroughs to be Presented at Upcoming IEEE ECTC Conference
The IEEE Electronic Components and Technology Conference (ECTC) is the world’s premier conference and product exhibition for bringing together the best in chip packaging, components, and microelectronic systems in an environment of cooperation and technical exchange.
Siemens Collaborates with TSMC to Drive Further Innovation in Semiconductor Design and Integration
Siemens Digital Industries Software today announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.
TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
Showcasing TSMC’s latest offerings for high performance computing, smartphone, automotive, and IoT applications.
BrainChip Extends RISC-V Reach with Andes Technology Integration
BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, brain-inspired AI, today announced the integration of its NPUs with RISC-V cores from Andes Technology, a provider of RISC-V embedded cores.
Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
Synopsys, Inc. announced today its ongoing close collaboration with TSMC to deliver robust EDA and IP solutions for TSMC’s most advanced processes and advanced packaging technologies to accelerate AI chip design and 3D multi-die design innovation.
Nearly $2M in State Grants, New Programs Will Advance Semiconductor Education at Washtenaw Community College
Nearly $2 million in grants at Washtenaw Community College (WCC), along with new associate degree and certificate programs, will advance Michigan’s mobility sector through semiconductor and battery education and training.
The Northeast Microelectronics Coalition Announces $1.43 Million to 19 Semiconductor Companies
The Northeast Microelectronics Coalition (NEMC) Hub today announced $1,432,373 in awards to 19 startups and small businesses through its Powering Regional Opportunities for Prototyping Microelectronics (PROPEL) Operations Program.
Brain-Inspired AI Breakthrough: Making Computers See More Like Humans
A team of researchers from the Institute for Basic Science (IBS), Yonsei University, and the Max Planck Institute have developed a new artificial intelligence (AI) technique that brings machine vision closer to how the human brain processes images.
xMEMS Labs Powers World’s First AI Sports Glasses with Cowell MEMS Tweeter
xMEMS Labs, Inc. today announced that its Cowell MEMS tweeter is now shipping in a groundbreaking AI sports glasses product from BleeqUp, a hardware startup based in China.
GlobalFoundries Accelerates GHG Reductions Commitments with Near Term Science-Based Target
GF’s revised targets will be set in line with Science Based Target Initiative (SBTi) standards.
Trump’s Semiconductor Tariffs Threaten to Affect US Medical Device Industry Growth, Says GlobalData
Donald Trump’s proposed semiconductor tariffs could pose a serious threat to the growth of the US medical device industry, as over half of all devices depend on semiconductors (chips) to operate.
Cadence Advances AI in the Cloud with Industry-First DDR5 12.8Gbps MRDIMM Gen2 Memory IP System Solution
High-performance data center and enterprise memory solution available now for customer engagements.
Mouser Electronics Receives 2024 Americas Titan Award for Digital POS by ams OSRAM
Mouser’s partnership with ams OSRAM supports Mouser customers in the development of automotive, industrial, and medical applications.
Liquid Cooling Technology Developed at Georgia Tech Awarded U.S. Patent
A liquid cooling system developed at Georgia Tech for electronics aims to solve a long-standing problem: overheating.
Featured Video
At SEMICON West 2024, Advanced Energy further expanded on the theme of ‘Advancing the Angstrom Era’ by demonstrating its latest plasma power, high-voltage and critical temperature measurement and control technologies. Editor-in-Chief Pete Singer talked to Dhaval Dhayatkar, a Senior Director of Marketing of Plasma Power at Advanced Energy, about the company’s latest products, including new, modular platforms that meet demands for high power, high efficiency and power density AC-DC solutions across semiconductor processing and test equipment.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
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